EM - Package Design Engineer

Otava Inc., based in Moorestown, New Jersey, is a fabless semiconductor company specializing in RF and millimeter-wave technologies. Our mission is to provide cutting- edge radio frequency integrated solutions for emerging defense, 5G/6G, and satellite communication applications. As a small and growing company, we concentrate on developing high-performance, wideband chips and system-on-chip (SoC) solutions.

We are seeking an enthusiastic and collaborative EM / Package Design Engineer to join our dynamic team. The ideal candidate will possess a strong technical background in RF and Microwave Electromagnetic analysis as well as some experience with package design and layout. This position requires excellent communication skills and a self-driven mindset, presenting significant opportunities for professional development and career advancement.

Key Responsibilities:

• Electromagnetic analysis of 2.5D and 3D microelectronic packages

• Design and layout of multi-chip packages in Allegro Package Designer

• Organize and present clear technical results during design reviews

Qualifications:

• MSEE or PhD in Electrical Engineering (required)

• Graduate school experience or 3+ years of industry experience in EM modeling or IC

  design with an interest in EM modeling

• Experienced with 3D electromagnetic solvers, such as HFSS

• Experienced with Cadence Virtuoso Schematic and Layout design flow.

• Strong team player mindset, driven to overcome design challenges, learn and

  succeed

• U.S. citizenship or Green Card holder (required)